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“github.com/cosmos/cosmos-sdk/x/params/types”
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Category:Windows gamesThe present invention relates to a multilayer substrate provided with a metallic layer on the surface thereof and having a plurality of conductor circuits formed in the metallic layer and an electronic component mounted on the multilayer substrate.
The substrate for electronic equipment having conductor circuits on both sides thereof is expected to have a higher mounting efficiency due to its reduced thickness. By the method for forming conductor circuits on the insulating surface of the substrate such as a multilayer substrate, the total thickness can be reduced.
However, the conventional multilayer substrate has a conductive film having a via hole or a through hole, which is formed of Al-based metal such as Al or Ag, on a surface of the insulating material such as Al-based resin to increase the substrate strength. In addition, there are problems such as dust or dirt generation due to the metal conductor circuit and the formation of void due to insufficient conductivity.
In order to solve such problems, JP-A-08-170762, for example, proposes a multilayer substrate obtained by forming a conductive coating layer in which an electroconductive material is mixed with a resin formed on a surface of an insulating substrate by the use of a resin composition prepared by reacting a phenoxy resin and a thioether-based amine curing agent.
However, there are problems such as the uneven surface of the resin coating layer due to the unduly increased amount of the conductive material and the insufficient adhesiveness between the resin coating layer and the insulating material. In particular, when the Al-based metal such as Al, etc. is used as the material of the conductive coating layer, the conductive coating layer is swollen by the action of Al, etc. to become separated from the insulating substrate.
JP-A-2001-178642, for example, proposes a multilayer substrate obtained by forming a circuit layer on the surface of the insulating substrate by the use of an electroconductive epoxy resin composition prepared by the reaction of an epoxy resin and a dispersion of metal particles.
However, there are problems such as the uneven surface of the resin coating layer due to the unduly increased amount of the conductive material and the uneven circuit pattern due to the unduly increased amount of the conductive material and insufficient adhesiveness between
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